China is fast becoming a global hub for semiconductor manufacturing, even Intel is setting up its most advanced manufacturing facility outside of the United States in China at a cost of $5.5 billion. Its facility at Dalian, China is going to produce next-generation chips such as the memory chips it will use in Optane SSDs from mid-2016.
Samsung is a major player in the semiconductor industry and it too is increasingly looking towards China for manufacturing. The company has further expanded production of 3D NAND flash memory in Xi’an China. Last year the monthly average wafer output was up to 20,000 but now it’s estimated that the figure has soared to 50,000 in the third quarter this year. By 2016 monthly average wafer output at Samsung’s facility in Xi’an is expected to peak at 100,000.
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