
Samsung, the world leader in semiconductor space, has announced that it has developed a new chip packing technology that could make chips faster and more power-efficient. The I-Cube4 technology is an improvement over the company’s I-Cube 2 technology from 2018 and X-Cube technology from 2020.
The company’s I-Cube4 (Interposer-Cube4) is a 2.5D heterogeneous chip packaging technology. It can be used...