The Samsung Galaxy S7 and the Galaxy S7 edge utilize liquid cooled heat pipes in order to quell any potential fears of device overheating among the consumers. A new report now suggests that this might pave the way for more manufacturers to join the fray, which effectively means that heat pipe manufacturers can expect to get more business in the months to come.
Smartphone OEMs have historically been hesitant to use proper heat pipes on devices given the relatively smaller life cycle of mobile devices. Instead, manufacturers rely on graphite based heat dissipation methods, which have proven to be ineffective in most cases. But Samsung has clearly sparked off a new trend by using a liquid cooled heat pipe to properly and evenly distribute heat generated by the CPU.
It must be noted that Samsung is only utilizing heat pipes in the Snapdragon 820 models (U.S. only) of the Galaxy S7 and the S7 edge, while the Exynos 8890 variants don’t have a heat pipe on board. So clearly, Samsung is still wary of Qualcomm’s silicon following the Snapdragon 810 debacle from last year, where the company wisely decided to leave out the chipset from its 2015 Galaxy flagships.
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